Characterization and Applications of Spatial Variation Models for Silicon Microring-Based Optical Transceivers
PROCEEDINGS OF THE 2020 57TH ACM/EDAC/IEEE DESIGN AUTOMATION CONFERENCE (DAC)(2020)
摘要
Photonic integrated circuits suffer from large process variations. Effective and accurate characterization of the variation patterns is a critical task for enabling the development of novel techniques to alleviate the variation challenges. In this study, we propose a hierarchical approach that effectively decomposes the spatial variations of silicon microring-based optical transceivers into wafer-level, intra-die, and inter-die components. We then demonstrate that the characterized variation models can be used to generate trustworthy synthetic data for architecture- and system-level solutions for variation alleviation. We further demonstrate the utility of our variation characterization method for accurate yield prediction based on partial measurement data.
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关键词
spatial variation models,silicon microring-based optical transceivers,photonic integrated circuits,process variations,variation patterns,spatial variations,inter-die components,characterized variation models,variation alleviation,variation characterization method
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