A Novel Chip-Join Assembly Using Heterogeneous Sn-Ag Bumps

Abderrahim El Amrani,Étienne Paradis,David Danovitch,Dominique Drouin

IEEE Transactions on Components, Packaging and Manufacturing Technology（2021）

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摘要

In this article, a flip-chip assembly using a heterogeneous solder bump structure is studied. The metallurgical and shape evolution, from bump fabrication through final assembly, is presented, characterized, and discussed. Aiming for lower residual stress during flip-chip assembly, a sequentially plated bump is fabricated to ensure a ductile low Ag content solder proximate to the fragile chip back...

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关键词

Nickel,Electrochemical deposition,Shape,Packaging,Manufacturing,Soldering,Scanning electron microscopy

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