How 3D integration technologies enable advanced compute node for Exascale-level High Performance Computing?

D. Dutoit, P. Coudrain, P.-Y. Martinez,P. Vivet,J. Charbonnier, A. Garnier, D. Lattard,S. Cheramy,E. Guthmuller,A. Philippe,Y. Thonnart, F. Clermidy

2020 IEEE International Electron Devices Meeting (IEDM)（2020）

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摘要

Supercomputers will soon achieve Exascale-level computing performances mainly thanks to the introduction of innovative hardware technologies around the processors. This article explains architectural and performance evolutions and describes how 3D integration technologies have allowed heterogeneity and increased bandwidth that are decisive for hardware innovations contributing to Exascale.

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关键词

advanced compute node,innovative hardware technologies,performance evolutions,3D integration technologies,hardware innovations,exascale-level computing performances,exascale-level high performance computing

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