PACT: An Extensible Parallel Thermal Simulator for Emerging Integration and Cooling Technologies
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems(2022)
摘要
Thermal analysis is an essential step that enables co-design of the computing system (i.e., integrated circuits and computer architectures) with the cooling system (e.g., heat sink). Existing thermal simulation tools are limited by several major challenges that prevent them from providing fast solutions to large problem sizes that are necessary to conduct standard-cell level thermal analysis or to...
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关键词
Integrated circuit modeling,Cooling,Thermal analysis,Computational modeling,Transient analysis,Thermal conductivity,Solid modeling
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