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Improved fracture resistance of Cu/Mo bilayers with thickness tailoring

SCRIPTA MATERIALIA(2021)

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摘要
The fracture toughness of Mo in Cu/Mo bilayers on polyimide was assessed with in situ X-ray diffraction during uniaxial tensile straining. The fracture resistance of Mo acting as an adhesion layer greatly depends on the thickness of the Cu layer exhibiting a toughening effect with increasing Cu layer thickness. In contrast, the presence of the Mo interlayer greatly decreases the apparent K-Ic of the Cu layers. The quantification of K-Ic for Mo with a Cu top layer provides further evidence that when brittle layers are used, a thicker ductile layer is advantageous to create fracture resistant stretchable systems. (C) 2021 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
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关键词
Thin films,Fracture,X-ray diffraction,Electrical resistivity,In situ
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