Thermal Design, Optimization, and Packaging of Planar Magnetic Components

Ercan M. Dede,Yucheng Gao,Yuqing Zhou,Vivek Sankaranarayanan, Feng Zhou,Dragan Maksimović,Robert W. Erickson

IEEE Transactions on Components, Packaging and Manufacturing Technology（2021）

引用 12|浏览10

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摘要

This article is focused on the thermal design and three-dimensional (3-D) package optimization of planar magnetic components (PMCs), including transformers and inductors for application in an electric vehicle composite boost dc–dc converter. Each PMC comprises electrical windings in printed circuit board (PCB) form in combination with a ferrite core. Multiple features of each PMC package are therm...

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关键词

Thermal conductivity,Windings,Thermal resistance,Packaging,Electronic packaging thermal management,Conductivity,Thermal management

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