Bottom-Up Life-Cycle Assessment of MEMS Piezoresistive Pressure Sensors

Thibault P. Delhaye,Grégoire Le Brun,Denis Flandre,Jean-Pierre Raskin

2021 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP)（2021）

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摘要

The manufacturing of modern silicon-based MEMS requires highly energy- and resource-intensive processes. Understanding and gathering objective data of the impacts of silicon manufacturing is crucial to select design strategies reducing the environmental impacts. In this work, we present a bottom-up assessment of the embodied energy and carbon footprint of two piezoresistive pressure sensors, by ad...

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关键词

Pressure sensors,Micromechanical devices,Adaptation models,Wet etching,Sensitivity,Silicon,Manufacturing

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