Persistent Homology Analysis Of Complex High-Dimensional Layout Configurations For Ic Physical Designs

DESIGN-PROCESS-TECHNOLOGY CO-OPTIMIZATION FOR MANUFACTURABILITY XIII(2019)

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摘要
Problems in simulation, in physical defects, or in electrical failures of the IC devices generally occur at the boundaries of dimensional tolerances, such as the minimum width and space. However, for layout configurations with four or more critical dimensions, simple minimums are insufficient to characterize dimensional coverage. Persistent homology is a multi-resolution analysis technique which robustly summarizes dimensional coverage. We apply this technique to compare dimensional coverage of IC design configurations, on the same layer, on different layers, and on different designs, yielding results both expected and unexpected based on manufacturing process and design rule knowledge.
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关键词
integrated circuit, design, manufacturing, configuration, topological data analysis, persistent homology
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