Organoiodine Functionality Bearing Resists For Electron-Beam And Helium Ion Beam Lithography: Complex And Sub-16 Nm Patterning

ACS APPLIED ELECTRONIC MATERIALS(2021)

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摘要
Given the current need for resist materials for patterning transistors with ultralow nodes, there has been a quest for developing resists with improved performance for nanoscale patterning with good contrast. The present work demonstrates polymeric resists (MAPDST-TIPMA) developed through the integration of a radiation-sensitive monomer (MAPDST) with an organoiodine functionality (TIPMA) for sub-16 nm patterning using electron-beam and helium ion beam lithography. The structural integrity was established by several spectroscopic techniques particularly NMR, FTIR, XPS, and GPC. These polymeric resists possess weight-average molecular weight (M-w) in the range of 10000-12000 with low PDI. While the resists 3a and 3b were synthesized with feed ratios of 80:20 and 70:30 of the monomers MAPDST and TIPMA, respectively, the actual microstructure compositions were calculated, using XPS and GPC data, to be similar to 94:6 and 91:9, respectively. The present resists have the potential for patterning 16 nm line/space features when exposed to e-beam. Also, 15 nm features were successfully patterned using MAPDST-TIPMA resists. The line edge roughness (LER) and line width roughness (LWR) of the 20 nm L/3S features were calculated to be 2.48 and 3.6 nm, respectively. Moreover, complex nanofeatures of different shapes were successfully patterned using 3b. A critical analysis of nanofeatures using AFM revealed that the patterns are very well developed with a sharp wall profile. The normalized resist thickness (NRT) curve was established to evaluate the sensitivity of the present resist which was calculated to be 341 mu C/cm(2) at 20 keV. The nature and slope of the NRT curve indicated that MAPDST-TIPMA is a negative tone resist with good contrast. Finally, the resist was found to be highly sensitive to He+ beam (sensitivity similar to 6.21 mu C/cm(2)) resulting in 20 nm L/S as well as 15 nm features with a good wall profile.
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关键词
copolymer, organoiodine resist, electron-beam lithography, helium ion beam lithography, sub-16 nm patterning
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