A Flexible Chip-Film Patch and a Flexible Strain Gauge Sensor Suitable for a Hybrid System-in-Foil Integration

Hybrid Systems-in-Foil (HySiF) encompass large-area thin-film electronics and ultrathin, high performance CMOS chips, which are integrated into a flexible polymeric foil substrate. In this work, the individual components of a customized flexible sensor system are characterized in detail, i.e., a strain gauge and a readout ASIC, and the system functionality is proved. We employ the...