Detection of Local Cu-to-Cu Bonding Defects in Wafer-to-Wafer Hybrid Bonding Using GHz-SAM

Ingrid de Wolf,Ahmad Khaled,Soon-Wook Kim,Eric Beyne,Michael Kögel,Sebastian Brand, Tatjana Djuric-Rissner, Ingo Wiesler

International Symposium for Testing and Failure AnalysisISTFA 2018: Conference Proceedings from the 44th International Symposium for Testing and Failure Analysis（2018）

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摘要

Abstract This paper demonstrates the application of GHz-SAM for the detection of local non-bonded regions between micron-sized Cu-pads in a wafer-to-wafer hybrid bonded sample. GHz-SAM is currently the only available non-destructive failure analysis technique that can offer this information on wafer level scale, with such high resolution.

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