Thermal Heat Path Signature of a Standard D2PAK Power Package by Transient Thermal Characterization and Modelling

Maik Sternberg,Kaushal Arun Pareek,Daniel May,Mohamad Abo Ras,Bernhard Wunderle

2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)（2022）

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摘要

The miniaturization of electronic devices with enhanced performance comes at the cost of thermal challenges. When a device fails, it is necessary to analyze and isolate the failure in the device. A non-destructive analysis of the device is always preferred over a destructive one. Apart from being cost-effective, the non-destructive analysis also helps us to perform more than one analysis technique...

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standard d2pak power package,transient thermal characterization

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