Ti thin films deposited by high-power impulse magnetron sputtering in an industrial system: Process parameters for a low surface roughness

The influence of the choice of process parameters in an industrial high-power impulse magnetron sputtering (HiPIMS) system on the surface roughness and crystallinity of Ti coatings is presented in this work. A current density of 1 A/cm(2) was kept constant by varying the pulse frequency to control the average power. The films were characterised by scanning electron microscopy, atomic force microscopy, X-ray diffraction and transmission electron microscopy. The surface roughness, residual stress and grain size are discussed as a function of the HiPIMS target average power in the 1.45-7.90 kW range. The surface roughness, ranging from 14 to 24 nm, is lower than that of the SnO2 glass substrate, and has a non-linear dependence on the HiPIMS power. X-ray 20 diffraction shows (100), (001) and (101) orientation of the film crystallites. The peak shifts reveal a gradual reduction in residual stress as target power increases. Further, the effect of target power on crystal grain length and geometric orientation is also determined.