Numerical investigation on the temperature effect in nanometric cutting of polycrystalline silicon

Changlin Liu,Wanting Xu,Jianguo Zhang,Junfeng Xiao,Xiao Chen,Jianfeng Xu

International Journal of Mechanical Sciences（2022）

引用 7|浏览9

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摘要

•The temperature effect on cutting mechanism of poly-Si was investigated by MD simulation.•The crack formation and propagation process at high cutting temperature was investigated.•The Plastic deformation depth was calculated and analyzed based on the atomic displacement.•The distance distribution function is defined to describes the inter-granular and intra-granular amorphization.

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关键词

Molecular dynamics simulation,Nanometric cutting,Polycrystalline silicon,Subsurface damage,Material removal mechanism

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