Chemically Integrated Ni-P Film Resistors with Controllable Resistance Values on Printed Circuit Board

Integrated process instead of surface mounted technology can reduce high-frequency parasitic effect of common components and improve the reliability of printed circuit board. In this work, a real-time monitoring technology was developed to test the resistance values of integrated resistors. Ni-P film resistors monitored under the real-time monitoring technology were integrated on epoxy resin surface by electroless plating method. The surface morphology of Ni-P film resistor deposited at different temperature were characterized by SEM. The influence of Ni-P film resistor shapes on resistance error was analyzed. The results show that the integrated Ni-P film resistor has the minimum resistance error of 3.2 % when the electroless plating bath temperature is at 80 °C. The resistance error of arbitrary shapes is controlled within 5 %. The Laminate process, thermal shock and thermal recycling experiments confirm that integrated Ni-P film resistors possess excellent thermal and mechanical stability. These interesting features indicate that integrated Ni-P film resistors monitored under the real-time monitoring technology have tremendous potential in manufacture of PCB with high reliability and high precision resistors.