An Architecture for On-Chip Face Recognition in a Compressive Image Sensor

2022 IEEE 35th International System-on-Chip Conference (SOCC)(2022)

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摘要
Compressive sensing has been widely explored for image reconstruction; however, compressed samples themselves contain relevant signal information and, hence, could be exploited for inference purposes. Many previous studies investigated image recognition on compressed samples, but few of them considered on-chip realization. In this study, an architecture for face recognition that exploits compressed samples was investigated. We found that by using a linear support-vector-machine (SVM) classifier with such samples as input, faces can be recognized with higher performance than in previous works for the level of compression expected in a system-on-chip (SoC) implementation. To compare our results with those of existing works, a figure of merit is proposed. Three image datasets were analyzed to cover diverse aspects, such as variation in illumination, different poses, aging effect, and changing backgrounds. The compression scheme shows robustness under this variety of input signals. A pseudo-diagonal measurement matrix and an architecture suited for in-sensor on-chip implementation are proposed. The resulting inference framework is suitable for an SoC implementation encompassing an image sensor to perform CS acquisition and a DSP to run the SVM.
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关键词
Compressive sensing,high-level inference,face recognition,measurement matrix,support vector machine
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