Demonstration of near-field capacitive standard communication bus for ultrathin reconfigurable sensor nodes

2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)(2022)

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摘要
This paper proposes a simple and effective method to wirelessly connect a microcontroller to a sensor using Serial Peripheral Interface (SPI). The transmission is done using capacitive interconnections. A pair of electrodes replaces the ohmic connection between the Integrated Circuits (IC). Our system is suited for prototyping ultrathin electronics and reconfigurable interfaces with sensors. A wireless communication with a packet error rate of 0.4 % between a microcontroller and a TC72 temperature sensor is demonstrated.
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关键词
sensors,capacitive interconnections,wireless communication,wearables,thin electronics,SPI bus
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