Ballast: Implementation of a Large MP-SoC on 22nm ASIC Technology

Antti Rautakoura,Timo Hämäläinen,Ari Kulmala, Tero Lehtinen, Mehdi Duman, Mohamed Ibrahim

2022 25th Euromicro Conference on Digital System Design (DSD)(2022)

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摘要
Chips have become the critical asset of the technology, and increasing effort is put to design System-on-Chips (SoC) faster and more affordable. Typically the focus of the research has been on the Power, Performance and Area optimization of the specific component or sub-system. To improve the situation we report design effort for complex SoC counted from specification to ASIC tape-out to lay out a solid reference for the community. Ballast is the first SoC-Hub chip taped out on 22nm technology. It includes six sub-systems on 15 mm 2 area and reaches 1.2GHz top speed. The design team included 24 persons and spent 21 200 person hours to tape-out in one calendar year from scratch. This is an outstanding achievement and sets the baseline to SoC design productivity development.
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关键词
System-on-Chip,ASIC,System architecture,Methodology development
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