Ballast: Implementation of a Large MP-SoC on 22nm ASIC Technology
2022 25th Euromicro Conference on Digital System Design (DSD)(2022)
摘要
Chips have become the critical asset of the technology, and increasing effort is put to design System-on-Chips (SoC) faster and more affordable. Typically the focus of the research has been on the Power, Performance and Area optimization of the specific component or sub-system. To improve the situation we report design effort for complex SoC counted from specification to ASIC tape-out to lay out a solid reference for the community. Ballast is the first SoC-Hub chip taped out on 22nm technology. It includes six sub-systems on 15 mm
2
area and reaches 1.2GHz top speed. The design team included 24 persons and spent 21 200 person hours to tape-out in one calendar year from scratch. This is an outstanding achievement and sets the baseline to SoC design productivity development.
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关键词
System-on-Chip,ASIC,System architecture,Methodology development
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