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Neural Network-based Fast and Intelligent Signal Integrity Assessment Model for Emerging MWCNT Bundle On-Chip Interconnects in Integrated Circuit

Gulafsha Bhatti,Takshashila Pathade,Yash Agrawal,Vinay Palaparthy,Bakul Gohel,Rutu Parekh,Mekala Girish Kumar

IETE JOURNAL OF RESEARCH（2024）

Cited 1|Views1
Key words
Machine learning (ML),Multiwall carbon nanotube bundle (MWCNTB),Neural network (NN),On-chip interconnects,Signal integrity
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