Solvent-Assisted Filling of Liquid Metal and Its Selective Dewetting for the Multilayered 3D Interconnect in Stretchable Electronics (vol 16, 21471, 2022)Woojin Jung,Gyan Raj Koirala,Ju Seung Lee,Jong Uk Kim,Byeonghak Park,Young Jin Jo,Chanho Jeong,Haeleen Hong,Kiyoon Kwon,Yeong-sinn Ye,Jiwon Kim,Kanghyuk Lee,Tae-il KimACS NANO(2023)引用 0|浏览2暂无评分AI 理解论文溯源树样例生成溯源树,研究论文发展脉络Chat Paper正在生成论文摘要