Non-intrusive electro-thermo-mechanical reduced model for diagnosis and prognostic on IGBT power modules

2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)(2023)

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摘要
In this work, a reduced model based on the Proper Generalized Decomposition is developed to model the electro-thermo-mechanical of IGBT power module. The reduced model enables obtaining the solution to the coupled problem considering multiple model parameters. Focusing on the wire bond lift-off mechanism, a lifetime model is built based on the stress level at the wire bond metallization interface. The reduced model is then advantageously used to perform model updating using Bayesian inference.
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