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Effect of Chemical Factors on Electrical Conductivity of Interconnection Between Carbon-Nanotube-Filled Conductive Pastes and Copper Electrodes

2023 International Conference on Electronics Packaging (ICEP)(2023)

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摘要
The effect of binder chemistry on the dynamic percolation of CNT-filled electrically conductive pastes was examined, including the interfacial electrical conductivity development with a copper electrode. The electrical conductivity development was influenced by adding reactive diluent into the binder. The surface chemical state of the electrodes also affected the electrical conductivity development kinetics with them. Some reactive diluents can accelerate the kinetics regardless of the surface chemistry of the electrode. The binder chemistry is one of the essential points in controlling the electrical conductivity of CNT-filled pastes.
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关键词
Printed electronics,Electrically conductive pastes,Carbon nanotubes,Metal electrodes,Interfacial electrical resistance
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