A novel chip-scale heterogeneous integration intelligent micro-system of short wave infrared imaging

In this paper, a novel heterogeneous integrated intelligent micro sensing system for short-wave infrared (SWIR) sensing and processing is proposed, which can detect and recognize objects based on image signals, and realize the complete function of “sensing-process-communication” at the chip scale. Here, we innovatively adopt chip scale heterogeneous integration (CSHI) to achieve high-density integration of sensor, analog and digital chips with different substrates and different process nodes by vertically interconnecting the 2.5 dimension (2.5 D) Through-Silicon Via (TSV) silicon interposer and 3 dimension (3D) high temperature co-fired ceramics (HTCC) ceramics. The short-wave infrared image detection and recognition system with high performance, small size and high reliability is realized on the premise of maintaining good interconnect power supply and signal integrity, and the feasibility of the proposed comprehensive approach is verified. Sensors, analog and digital chips of different substrates and process nodes are integrated into a micro-system at the chip level through this approach. The approach presented in this paper is an effective solution to realize intelligent sensing micro-system, which can effectively extend functions and improve integration level at the chip scale.