A micro and low-cost packaging technology of high accuracy piezoresistive pressure sensors with Parylene coating.

Packaging technology for pressure sensors has always been a problem for protecting sensors applied in harsh environments. In this research, a micro, low – cost packaging method with high dynamic response for the application of high accuracy piezoresistive pressure sensors in corrosive and conductive medium is proposed. Tests for the performance of high accuracy sensors indicate that the method has small package effect and is low-cost than traditional encapsulation process.