Multiprocess Additive Manufacturing Via Fused Deposition Modeling, Chemical Deposition, and Electroplating with Tough Interfacial Adhesion

Multiprocess additive manufacturing (MPAM) unlocks new materials and design spaces where multimaterial components consisting of polymers, metals, and ceramics can be produced as one consolidated part. MPAM enables state-of-the-art 3D-printed electronics and devices with embedded functionality by combining fused deposition modeling with chemical deposition and electroplating processes. However, the metalized plastic devices produced by these processes have a short lifespan because of their poor structural integrity due to the low adhesion at the metal–polymer interface. In this study, we elaborated on the adhesion mechanism at the 3D-printed metal–polymer interface and identified the MPAM factors that elevated significantly the integrity of metalized plastic components. The effects of the 3D-printed surface texture and surface treatment on the adhesion strength of copper plated on acrylonitrile–butadiene–styrene parts were analyzed. We found that a certain 3D-printed topography modified by quick acid etching created a hierarchically structured interface with superimposed macroscale, microscale, and nanoscale roughness that symbiotically improved the metal–polymer adhesion. These results have practical implications for automated equipment manufacturers and the electronic industry adapting MPAM for the 3D printing of multimaterial components and devices with embedded functionality.