ARTSim: A Robust Thermal Simulator for Heterogeneous Integration Platforms

Chiplet-based integration is a paradigm shift in system design and advanced packaging methodologies. A robust early-stage design tool supporting the thermal simulation of chiplet-based systems is essential to ensure efficient thermal management and high thermal design power. ARTSim, a robust compact thermal simulator for heterogeneous integration platforms, is presented in this work. ARTSim supports efficient thermal modeling of chiplet-based systems. ARTSim is based on a novel hybrid meshing structure that enables customization of the simulation granularity at the functional block level. Furthermore, ARTSim is backward-compatible with conventional two- and three-dimensional packaging platforms. Simulation results from ARTSim on a floorplan similar to the Alpha 21264/EV6 processor, were compared to results obtained from state-of-the-art finite element method tools. Simulation results confirm that the temperature accuracy of the thermal maps generated by ARTSim is within 3.7% maximum error, while exhibiting a reduction in runtime of up to two orders of magnitude.