Ultrasonic-induced metallurgical bonding between W90 tungsten heavy alloy and AZ31B Mg alloy using Sn

Xudong Zhang,Wei Fu,Xiaoguo Song,Zhuolin Li,Weimin Long,Danyang Lin,Yanyu Song,Sujuan Zhong

MATERIALS LETTERS（2023）

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摘要

•W90 and Mg alloy were firstly bonded by ultrasonic-assisted soldering at 250 °C.•A semi-coherent interface was formed between Sn and W.•The joint strength treated with the ultrasonication time of 2 s reached 10.4 MPa.

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关键词

Metals and alloys,Microstructure,Shear strength,Ultrasonic-assisted soldering,Interface

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