Experimental Measurement of the Thermal Conductivity of Fused Deposition Modeling Materials with a DTC-25 Conductivity Meter

The expansion and low cost of additive manufacturing technologies have led to a revolution in the development of materials used by these technologies. There are several varieties of materials that can be used in additive manufacturing by fused deposition modeling (FDM). However, some of the properties of these materials are unknown or confusing. This article addresses the need to know the thermal conductivity in different filaments that this FDM technology uses, because there are multiple applications for these additive manufacturing products in the field of thermal insulation. For the study of thermal conductivity, the DTC-25 commercial conductivity measurement bench was used, where the tests were carried out on a set of seven different materials with 100% fabrication density-from base materials such as acrylonitrile butadiene styrene (ABS) or polylactic acid (PLA), to materials with high mechanical and thermal resistance such as thermoplastic polyurethane (TPU), polyether ether ketone (PEEK), and high-performance polyetherimide thermoplastic (ULTEM), to materials with metal inclusions (aluminum 6061) that would later be subjected to thermal after-treatments. This study shows how the parts manufactured with aluminum inclusions have a higher thermal conductivity, at 0.40 +/- 0.05 W/m center dot K, compared to other materials with high mechanical and thermal resistance, such as TPU, with a conductivity of 0.26 +/- 0.05 W/m center dot K.