Stress‐Free Detachment of Flexible Substrate from Glass Carrier Using CO₂ Point Laser for Large‐Area Applications (Adv. Mater. Interfaces 13/2023)

Flexible Electronics In article number 2202337, Hyuk Park, Yoonyoung Chung, and colleagues use a roll-to-roll process to fabricate electronic devices on a flexible substrate. Point laser beams are applied along the edge of each device, and they are gently detached from the applied edge by a tensile force generated by the roll curvature. After the laser illumination, the devices are entirely separated from the carrier.