A 200-Ghz Four-Element Phased-Array Receiver System-in-Package Using HTCC Technology for Sub-Terahertz Communications
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES（2024）
Key words
Heterogeneous integration,high-temperature co-fired ceramic (HTCC),local-oscillator (LO) beamforming,phased-array receiver,16-quadrature amplitude modulation (QAM) and 64-QAM,system-in-package (SiP),200 GHz,wireless communications
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