Direct Metallization-Based DBC-Free Power Modules for Near-Junction Water Cooling: Analysis and Experimental Comparison
IEEE Transactions on Power Electronics（2024）
Key words
Multichip modules,Cooling,Copper,Thermal resistance,Junctions,Water heating,Heating systems,3-D packaging,direct bonded copper (DBC)-free power module,junction temperature,near-junction water cooling,thermal resistance
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