Performance comparison of photosensitive polyimides for high-resolution dual-damascene schemes for FOWLP packaging applicationsLuisa D. Bozano, Roger Quon, Ben Briggs, Ryan Ley, Athena Pang, Peng Suo,Prayudi Lianto, Andy Yong,Arvind Sundarrajan, Jorge P. Fernandez, Niranjan Khasgiwale, C. C. Chuang, Jang Fung Chen,Siddarth Krishnan, Mike Chudzik, Chris BencherAdvances in Patterning Materials and Processes XLI（2024）引用 0|浏览3暂无评分AI 理解论文溯源树样例生成溯源树，研究论文发展脉络Chat Paper正在生成论文摘要
