Ferroelectric memory devices using hafnium aluminum oxides and remote plasma-treated electrodes for sustainable energy-efficient electronics

In this work, we adopt a low-temperature sustainable plasma treatment approach for the fabrication of ferroelectric memory devices. From our experimental results, we found that the ferroelectric polarization characteristics of HfAlOx ferroelectric device could be further improved by using low-temperature nitrogen plasma treatment on bottom TiN electrode for surface modification. The low-temperature nitrogen plasma treatment on TiN bottom electrode not only prevent electrode oxidation, but also lowers the generation of defect traps at the interface between ferroelectric HfAlOx and TiN bottom electrode during high-temperature ferroelectric annealing process. Besides, the nitrogen-treated bottom electrode also can improve bias-stress induced instability and cycling endurance of HfAlOx ferroelectric devices due to the effective suppression of randomly distributed defect traps or oxygen vacancies near the surface of bottom electrode.