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个人简介
Brian W. Thompto IBM Systems, Austin, TX 78758
USA (bthompto@us.ibm.com). Mr. Thompto is a Senior Technical Staff Member on the POWER processor
development team. He joined IBM in 1999 after graduating from the University of Wisconsin–Madison with a B.S.
degree in electrical engineering and a second major in computer science. At IBM, he has been a senior leader and the
principal engineer for both IBM POWER and IBM Z processor teams across a number of disciplines and technologies. For
POWER9, he was a lead architect and the overall performance lead for the processor chip. Mr. Thompto currently is the
chief core architect for the next generation of the POWER processor. He is an IBM Master Inventor with over 50 patent
applications granted or pending.
研究兴趣
论文共 5 篇作者统计合作学者相似作者
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José E. Moreira, Kit Barton, Steven Battle, Peter Bergner,Ramon Bertran,Puneeth Bhat, Pedro Caldeira,David Edelsohn, Gordon Fossum, Brad Frey, Nemanja Ivanovic, Chip Kerchner,
arxiv(2021)
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