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Tushar Sharma (Member, IEEE) received the Ph.D. degree from the University of Calgary, Calgary, AB, Canada, in 2018, with a focus on the high-efficiency gallium nitride technology characterization and design of power amplifier architectures for 5G base station applications.
Thereafter, he joined the Integrated Microsystems Research Laboratory, Princeton University, Princeton, NJ, USA, a Post-Doctoral Research Associate, where he was involved in exploring the novel reconfigurable techniques in RF and millimeter-wave transmitters (30–100 GHz) for 5G and beyond. In 2016, he joined the RF Power Group of NXP Semiconductors, Chandler, AZ, USA, as a Research and Development Engineer to steer the GaN technology evaluation and pursue product development using advanced harmonic tuned classes, waveform shaping, and large-signal device modelling to support NXP’s Technology and Innovations business line. He has authored or coauthored over 35 refereed publications and holds three U.S. patents—awarded or pending. His research areas include millimeter-wave (30–100 GHz) advanced transmitter architectures in CMOS, GaN, InP, high-power (50–300-W) broadband amplifiers for cellular infrastructure, passive/active load–pull techniques for device characterization, and waveform engineering.
Dr. Sharma was a recipient of the Izaak Walton Killam Pre-Doctoral Scholarship, the Alberta Science and Innovation Under 30 Future Leader Award, the Alberta Innovates Technology Future Doctoral Scholarship, the Alberta Transformative Talent Scholarship, the IEEE Education Activity Board Pre Educator Award, the IEEE MGAYoung Professionals Achievement Award, and the University of Calgary 2018 Early Achievement Alumni Award.
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IEEE Transactions on Microwave Theory and Techniquesno. 5 (2023): 1990-2003
IEEE Transactions on Microwave Theory and Techniquesno. 5 (2023): 1977-1989
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUESno. 12 (2023): 5526-5527
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IEEE ACCESS (2022): 128408-128423
2022 IEEE Conference on Antenna Measurements and Applications (CAMA)pp.1-5, (2022)
2022 IEEE/MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM (IMS 2022)pp.414-417, (2022)
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