Several kinds of micro optics array have been developed to form aerial images in the mid‐air, and we propose evaluation methods for imaging performance of the optical system using the micro optics array. To evaluate the influence caused by aperture limitation of micro optics array and diffraction, the MTF measurement method using a knife edge has been improved considering the viewing direction/angle dependence.
This paper introduces D2ELPHI (Dynamic DELPHI), a transient thermal network model for semiconductor packages that has been standardized and published by JEITA (ED-7800). This model is supposed to be used in the time order of 1msec or more. If an assembly manufacturer wants to predict junction temperature of a semiconductor package by computer simulation for an electronic device, a thermal model of that package is required. However, the model cannot be easily created by themselves and must be obtained from the package manufacturer. Thermal resistance network model DELPHI, standardized by EU manufacturers in the mid-1990s, is limited to use for steady-state simulations. The D2ELPHI model is based on the DELPHI model and includes heat capacities to support transient simulation. When setting heat capacities of D2ELPHI model, it is important to reflect heat path of the target package.
We evaluated allowable limit for the display‐frame glare by reflected light. In the results, the AR treatment didn't decrease the level of allowable luminance to disturbing glare nor contribute to reduce such disturbing glare. The allowance strongly depends on the luminance contrast‐ratio between the reflected light and its background.
