Ball Grid Array (BGA) is an important technology for utilizing higher pin counts, without the attendant handling and processing problems of the peripheral leaded packages. They are also robust in processing because of their higher pitch (0.050 inches typical), better lead rigidity, and self-alignment characteristics during reflow processing.
Today's aircraft instruments offer improved performance and reliability in a smaller package size. The authors report how extensive use has been made of CMOS to reduce power, size and weight. The instruments described are based upon three aspects of design: solid-state signal processing, optoelectronic display format, and planned redundancy. Each instrument is packaged so that the P/C boards are readily accessible and can be placed on extension boards, resulting in a simplified servicing operation.
Humidity, temperature, contamination and disconnection effects on gasket and grease seals for extended space mission computer connectors
