2026 IEEE 29th International Symposium on Design and Diagnostics of Electronic Circuits and Systems (DDECS)(2026)
STMicroelectronics
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摘要
The semiconductor industry is adopting chiplets as an alternative to integrated circuit design. With adoption of off-the-shelf chiplets, supply chain attacks are likely to increase, making chiplet authentication essential. This work identifies post-stacking testing as the best phase for authentication and proposes a framework using existing industry standards. The framework includes a flexible authentication IP integrated into the chiplet design, compatible with various authentication methods; an IP insertion flow compatible with commercial DFT insertion tools; a secure module for the test environment; and the corresponding test procedure. Results show that chiplet authentication can be implemented without disrupting industry practices, with multiple authentication methods available based on the context.
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关键词
Chiplet,Authentication,Design-For-Testability (DFT),Learn Parity with Noise (LPN),3DIC,2.5DIC