A 3-Micron-radius Bend for SOI TE0/TE1 Multiplexing

Min Teng,Abdullah Al Noman,Yun Jo Lee,Ziyun Kong,Yi Xuan,Minghao Qi

2018 CONFERENCE ON LASERS AND ELECTRO-OPTICS (CLEO)（2018）

Purdue Univ

被引用3|浏览13

摘要

We propose a 3-micron-radius, TE0/TE1 multiplexed 90-degree bend that numerically exhibits 0.8 dB bending loss and 20 dB crosstalk suppression over 30nm bandwidth on an silicon-on-insulator platform. An S-bend shows >37 dB colorless crosstalk suppression.

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关键词

bending loss,colorless crosstalk suppression,three-micron-radius bend,SOI TE0/TE1 Multiplexing,silicon-on-insulator platform,noise figure 20.0 dB,noise figure 0.8 dB

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