All Solid-State Multi-Chip Multi-Channel WDM Photonic Module

I. Shubin,X. Zheng,H. Thacker,S. S. Djordjevic,S. Lin,P. Amberg,J. Lexau,K. Raj, J. E. Cunningham,A. V. Krishnamoorthy

Electronic Components and Technology Conference (ECTC)（2015）

Oracle

被引用29|浏览53

摘要

In this work we report on a packaged prototype of a WDM photonic transceiver. It is a hybrid assembly based on a 130 nm SOI photonic circuitry integrated with a 40 nm CMOS VLSI driver. Our prototype supports eight tunable WDM channels operating at 10 Gb/s each capable of both transmitting and receiving data on the same chip. We discuss two options to close the link while using the optical fiber or another waveguide bridge chip. We provide hybridization details and supporting link measurement data to describe packaged photonic module and its power efficient functionality as its on-chip power per channel averaged 1.3pJ/bit, laser electrical power excluded.

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关键词

solid-state multichip multichannel WDM photonic module,WDM photonic transceiver,hybrid assembly,SOI photonic circuitry,CMOS VLSI driver,tunable WDM channels,optical fiber,waveguide bridge chip,link measurement data,packaged photonic module,size 130 nm,size 40 nm,bit rate 10 Gbit/s

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