Chip-Embedded Two-Phase Cooling

WSPC Series in Advanced Integration and PackagingEmbedded Cooling of Electronic Devices, pp. 155-206 (2024) No AccessChapter 4: Chip-Embedded Two-Phase CoolingTimothy Chainer, Pritish Parida, and Mark SchultzTimothy ChainerIBM T. J. Watson Research Center, NY, USA, Pritish ParidaIBM T. J. Watson Research Center, NY, USA, and Mark SchultzIBM T. J. Watson Research Center, NY, USAhttps://doi.org/10.1142/9789811279379_0004Cited by:0 (Source: Crossref) PreviousNext AboutSectionsPDF/EPUB ToolsAdd to favoritesDownload CitationsTrack CitationsRecommend to Library ShareShare onFacebookTwitterLinked InRedditEmail Abstract: This chapter describes the experimental and modeling studies of two-phase chip-embedded cooling. The experimental investigation included chip-embedded cooling of a thermal test vehicle (TTV) and an embedded-cooled microprocessor (ECM). The modeling study included the development of both full- and reduced-physics two-phase flow boiling models, which were validated against the experimental data. The TTV was designed with chip-embedded radially expanding microchannels and a power map to mimic an eight-core microprocessor. The TTV enabled an experimental investigation of the limits of two-phase cooling, demonstrating cooling capability well beyond that of current microprocessor heat dissipation. Thermal modeling of the TTV chip-embedded cooling showed good agreement with the experimental data. The ECM module provided a test vehicle to directly compare chip-embedded cooling to a commercial air-cooled system. The air-cooled microprocessors in an IBM server were fully characterized in an environmental chamber and then modified by creating chip-embedded microchannels on the backside of the microprocessor die. A set of workloads was used to compare the performance of air- and embedded-cooled microprocessors. The ECM showed a significant reduction in chip junction temperature compared to air cooling, with the model in good agreement with experiments. The results showed that two-phase dielectric flow boiling provided highly effective cooling in microchannels with dimensions compatible with 3D chip stack cooling. Keywords: Electronics coolingtwo-phase coolingtwo-phase flowchip-embedded cooling FiguresReferencesRelatedDetails Recommended Embedded Cooling of Electronic DevicesMetrics History KeywordsElectronics coolingtwo-phase coolingtwo-phase flowchip-embedded coolingPDF download