4 design case studies using the 2.5-D integration scheme are presented in this chapter. The first 3 designs, a crossbar circuit, a Rambus DRAM, and a reconfigurable data-path (PipeRench), are re-designed by exploiting fine-grain inter-chip interconnects. The 4th design study involves a 3-D stacked CPU/memory system. The above design cases studies validate the potential of the 2.5-D integration paradigm from a performance point of view.