Electronic Packaging Moisture Interaction Study

Reliability defects associated with thermal humidity environments are not new to the electronics packaging industry, yet to this day it remains a key concern even for our latest technologies. Moisture absorbed into electronic packaging can impact package warpage, cause corrosion, underfill crack and interfacial delamination. Fundamental studies are needed to better understand the effect of moisture interaction with different package designs. This paper summarizes the lab experiments and Finite Element Analysis (FEA) that have been performed to study package moisture absorption-desorption, room temperature (RT) warpage and dynamic warpage, on packages post exposure to thermal humidity environment. This has yielded good fundamental learning and identified areas for future work.