Pumped two-phase cooling utilizing an interconnect compatible dielectric fluid is an enabling technology to fully optimize the benefits of the improved integration density possible with three-dimensional (3D) stacking, but is faced with significant developmental challenges, including the need for high fidelity modeling. In the present work, a Eulerian multiphase model developed for predicting two-phase flow and heat transfer behavior in parallel micro-channels and micro-pin fields has been extended to radial expanding channels populated with micro-pins. The model was used to design the cooling channel structures in and to predict the thermal behavior of an embedded two-phase liquid cooled microprocessor module. A detailed model validation showed that this model can predict the chip junction temperature to within two degrees of the experimental data.
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