Placing electronics sensor modules at high temperature regime is getting increasingly important for accurately monitoring performance life of aircraft engines or other sensitive thermal components. Electronics sensor modules capable of operating at high temperature also eliminates parasitic electronics cooling accessories and thus enables both weight and cost savings [1]. Usually in high temperature electronics modules, the electronics chips (dies) are bonded to the packaging board (heat sink) via a metalized dielectric substrate (heat spreader) in between, known to be are the directly bonded copper (DBC) or directly bonded alumina (DBA). In this work, a materials solution for the CTE mismatch issues in DBC is presented with two-phase amorphous alloy composition via Molecular Dynamics (MD) simulation. A two-phase Cu/Zr amorphous alloy composition of 0-45% Cu composition appears to show promise to match with the CTEs of ceramic substrates (such as AlN). This type of hybrid material composition is thus expected to provide a possible desirable material solution towards enhancing the fatigue life in high temperature electronics modules.
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