2024 14TH INTERNATIONAL WORKSHOP ON THE ELECTROMAGNETIC COMPATIBILITY OF INTEGRATED CIRCUITS, EMC COMPO 2024(2024)
Zhejiang Univ
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摘要
The demand for large-scale data samples has always been a significant bottleneck in the application of artificial intelligence methods in the field of electromagnetic compatibility (EMC) of integrated circuit (IC). This paper proposes the Transfer Learning Encoder-Decoder network (TL-ED) method for predicting circuit S-parameters. Considering the high computational cost involved in obtaining accurate high-fidelity data samples, this method utilizes transfer learning to transfer the rough model, which is modeled based on low-fidelity data with low computational costs, to the accurate model. Subsequently, the model is fine-tuned using a small amount of high-fidelity data. Application results confirm that this approach significantly reduces the demand for high-fidelity data and has the potential to be applied in IC-EMC analysis where data acquisition through testing experiments is necessary.
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关键词
IC Electromagnetic compatibility,neural network,S parameter,transfer learning