Three interfaces in ceramic substrates for electronic applications are reviewed. The substrates discussed here are aluminum nitraide A1N, glass/ceramic composite and magnesia. Calcium added A1N shows very tight and highly purified grain boundaries after 2000°C firing. The lattice constant of A1N changed by diffusion of oxygen in A1N lattice. This decreases the thermal conductivity. Alumina dispersed in B 2 O 3 -SiO 2 glass react with silica chain structure which prevent crystallization of glass/ceramic composite. This cause a steep change in thermal expansion curve. B i-Sr-Ca-Cu-O compound has been deposited on MgO single crystal. The Bi superconducting film grows with c-axis perpendicular and parallel to MgO surface.
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