Microphone Array Application Prototyping with MorPACK Heterogeneous Integrated System

This paper proposes a heterogeneous system platform to speed up the implementation and verification of innovative design for integrating microphone array application. Comparing to state-of-the-art prototyping systems, the proposed platform named MorPACK (morphing package) achieves modularity and flexibility by adopting three concepts: substrate-level modularization, three-dimensional (3D) module stack, and components reuse. In addition, we also provide the MorPACK platform which helps designers to concentrate their efforts on their own functional module(s), and easily reuse existing modules like playing bricks, which greatly reduce the development cycle of an embedded system. The implementation results show that there are 79.13% fabrication cost reduced by the MorPACK common platform in TSMC 90nm CMOS. Besides, around 60% performance improvement of operation frequency can be benefited. We adopt the microphone array cooperated with MorPACK to enhance the design flow arrangement. Furthermore, this application can be used as a reference design for distinct applications.