Optical Fiber Communication Conference (OFC) 2019（2019）
IBM Thomas J Watson Res Ctr
被引用37|浏览190
摘要
We report on efforts to develop a high speed, low cost, low energy chip scale optical module for co-packaging on a first-level organic substrate for HPC and Data Center applications.
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关键词
MOTION,low energy chip scale optical module,first-level organic substrate,Data Center applications,HPC applications,multiwavelength optical transceivers integrated on node
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