This study addresses the high defect rate (up to 99%) and the heavy dependence on operator experience in the Direct Memory Access (DMA) injection molding process. To overcome these limitations, the study applies the Taguchi method using L18 orthogonal arrays to systematically optimize six key process parameters: nozzle size, mold temperature, ejection pressure, binder chemical concentration, mold material weight, and molding time. Signal-to-noise (S/N) analysis and ANOVA were used to identify the most influential factors and determine the optimal settings. The results show a significant reduction in defect rates: delamination defects decreased from 20% to 4%, flat wire defects from 4% to 0.5%, and corrugated plastic defects from 0.6% to 0.1%. Notably, the integration of computer vision inspection and process optimization improved product quality and reduced production time. The novelty of this study lies in the systematic application of the Taguchi method to high-precision semiconductor processes and the combination with advanced testing technologies, opening up a new direction in process optimization for the industry.
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